Accelerating 5G Base Station Deployment Drives Surge in High-Frequency PCB Demand
Key Points
- In 2026, the three major carriers invested over 3000 billion yuan in 5G, adding more than 80 million new base stations.
- The high-frequency PCB market is projected to grow from 180 billion to 320 billion.
- Lexin has established strategic partnerships with multiple high-frequency PCB manufacturers to provide one-stop services.
In 2026, China's 5G base station deployment accelerated. Capital expenditure plans from the three major operators show that total 5G-related investment will exceed 3000 billion yuan, with over 80 thousand new 5G base stations built.
5G base stations impose far stricter requirements on PCBs than 4G. High-frequency, high-speed PCBs must use specialized substrates (e.g., PTFE or hydrocarbon resins) with low dielectric constant and low loss factor. Additionally, increased antenna integration in base stations demands higher layer counts, tighter line widths and spacing, and more precise impedance control.
Currently, the main domestic suppliers of high-frequency PCBs include Nanjing Circuit Technology (SCMC), Wus Printed Circuit Co., Ltd., and Shengyi Electronics. With the advancement of 5G infrastructure, the high-frequency PCB market is projected to grow from 180 billion yuan in 2025 to 320 billion yuan in 2027.
For supply chain companies, key considerations when procuring high-frequency PCBs include substrate selection, impedance control precision, surface finish processes, and reliability testing standards. Lexin Electronics Technology (Baiantu) has established strategic partnerships with multiple high-frequency PCB manufacturers to provide customers with end-to-end services from component selection to mass production.
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